document number: 94071 for technical questions, contact: diodestech@vishay.com www.vishay.com revision: 22-feb-10 1 hexfred ? ultrafast soft recovery diode, 2 x 15 a vs-HFA30TA60CSPBF vishay high power products features ? ultrafast recovery ? ultrasoft recovery ? very low i rrm ? very low q rr ? specified at operating conditions ? meets msl level 1, per j-std-020, lf maximum peak of 260 c ? halogen-free according to iec 61249-2-21 definition ? compliant to rohs directive 2002/95/ec ? aec-q101 qualified benefits ? reduced rfi and emi ? reduced power loss in diode and switching transistor ? higher frequency operation ? reduced snubbing ? reduced parts count description vs-hfa30ta60cs is a state of the art center tap ultrafast recovery diode. employing the latest in epitaxial construction and advanced processing techniques it features a superb combination of characteristics which result in performance which is unsurpassed by any rectifier previously available. with basic ratings of 600 v and 15 a per leg continuous current, the vs-hfa30ta60cs is especially well suited for use as the companion diode for igbts and mosfets. in addition to ultrafast recovery time, the hexfred ? product line features extremely low values of peak recovery current (i rrm ) and does not exhibit any tendency to snap-off during the t b portion of recovery. the hexfred features combine to offer designers a rectifier with lower noise and signific antly lower switching losses in both the diode and the switching transistor. these hexfred advantages can help to significantly reduce snubbing, component count and heatsink sizes. the hexfred vs-hfa30ta60cs is ideally suited for applications in power supp lies and power conversion systems (such as inverters), motor drives, and many other similar applications where high speed, high efficiency is needed. product summary v r 600 v v f at 15 a at 25 c 1.7 v i f(av) 2 x 15 a t rr (typical) 19 ns t j (maximum) 150 c q rr (typical) 80 nc di (rec)m /dt (typical) at 125 c 160 a/s i rrm (typical) 4.0 a d 2 pak base common catho d e common catho d e ano d e ano d e 2 1 2 3 absolute maximum ratings parameter symbol test conditions values units cathode to anode voltage v r 600 v maximum continuous forward current per leg i f t c = 100 c 15 a per device 30 single pulse forward current i fsm 150 maximum repetitive forward current i frm 60 maximum power dissipation p d t c = 25 c 74 c t c = 100 c 29 operating junction and storage temperature range t j , t stg - 55 to + 150 w
www.vishay.com for technical questions, contact: diodestech@vishay.com document number: 94071 2 revision: 22-feb-10 vs-HFA30TA60CSPBF vishay high power products hexfred ? ultrafast soft recove ry diode, 2 x 15 a electrical specifications per leg (t j = 25 c unless otherwise specified) parameter symbol test conditio ns min. typ. max. units cathode to anode breakdown voltage v br i r = 100 a 600 - - v maximum forward voltage v fm i f = 15 a see fig. 1 -1.31.7 i f = 30 a - 1.5 2.0 i f = 15 a, t j = 125 c - 1.2 1.6 maximum reverse leakage current i rm v r = v r rated see fig. 2 -1.010 a t j = 125 c, v r = 0.8 x v r rated - 400 1000 junction capacitance c t v r = 200 v see fig. 3 - 25 50 pf series inductance l s measured lead to lead 5 mm from package body - 8.0 - nh dynamic recovery characteristics per leg (t j = 25 c unless otherwise specified) parameter symbol test conditi ons min. typ. max. units reverse recovery time see fig. 5, 10 t rr i f = 1.0 a, di f /dt = 200 a/s, v r = 30 v - 19 - ns t rr1 t j = 25 c i f = 15 a di f /dt = 200 a/s v r = 200 v -4260 t rr2 t j = 125 c - 70 90 peak recovery current see fig. 6 i rrm1 t j = 25 c - 4.0 6.0 a i rrm2 t j = 125 c - 6.5 10 reverse recovery charge see fig. 7 q rr1 t j = 25 c - 80 180 nc q rr2 t j = 125 c - 220 450 peak rate of fall of recovery current during t b see fig. 8 di (rec)m /dt1 t j = 25 c - 188 - a/s di (rec)m /dt2 t j = 125 c - 160 - thermal - mechanical specifications per leg parameter symbol test conditio ns min. typ. max. units lead temperature t lead 0.063" from case (1.6 mm) for 10 s - - 300 c junction to case, single leg conducting r thjc --1.7 k/w junction to case, both legs conducting - - 0.85 thermal resistance, junction to ambient r thja typical socket mount - - 80 weight -2.0- g -0.07- oz. mounting torque 6.0 (5.0) - 12 (10) kgf cm (lbf in) marking device case style d 2 pak hfa30ta60cs
document number: 94071 for technical questions, contact: diodestech@vishay.com www.vishay.com revision: 22-feb-10 3 vs-HFA30TA60CSPBF hexfred ? ultrafast soft recovery diode, 2 x 15 a vishay high power products fig. 1 - maximum forward voltage drop vs. instantaneous forward current (per leg) fig. 2 - typical reverse current vs. reverse voltage (per leg) fig. 3 - typical junction capacitance vs. reverse voltage (per leg) fig. 4 - maximum thermal impedance z thjc characteristics (per leg) i f - instantaneous forwar d current (a) v fm - forwar d voltage drop (v) 1.0 1.2 1.4 1.6 2.0 1.8 2.2 2.4 1 100 10 94071_01 t j = 150 c t j = 125 c t j = 25 c i r - reverse current (a) v r - reverse voltage (v) 0 100 200 300 500 400 600 0.01 0.1 1 10 100 10 000 1000 94071_02 t j = 25 c t j = 125 c t j = 150 c c t - junction capacitance (pf) v r - reverse voltage (v) 0200400 100 300 500 600 10 100 94071_03 t j = 25 c 0.01 0.1 1 10 0.00001 0.0001 0.001 0.01 0.1 t 1 - rectangular pulse duration (s) z thjc - thermal response 10 1 94071_04 d = 0.50 d = 0.20 d = 0.10 d = 0.05 d = 0.02 d = 0.01 s ingle pul s e (thermal re s pon s e) p dm t 2 t 1 note s : 1. duty factor d = t 1 /t 2 2. peak t j = p dm x z thjc + t c
www.vishay.com for technical questions, contact: diodestech@vishay.com document number: 94071 4 revision: 22-feb-10 vs-HFA30TA60CSPBF vishay high power products hexfred ? ultrafast soft recove ry diode, 2 x 15 a fig. 5 - typical reverse recovery time vs. di f /dt (per leg) fig. 6 - typical re covery current vs. di f /dt (per leg) fig. 7 - typical stored charge vs. di f /dt (per leg) fig. 8 - typical di (rec)m /dt vs. di f /dt (per leg) t rr (ns) d i f / d t (a/s) 100 1000 0 100 80 20 40 60 94071_05 i f = 30 a i f = 15 a i f = 5 a v r = 200 v t j = 125 c t j = 25 c i rr (a) d i f / d t (a/s) 100 1000 0 25 20 5 10 15 94071_06 i f = 30 a i f = 15 a i f = 5 a v r = 200 v t j = 125 c t j = 25 c q rr (nc) d i f / d t (a/s) 100 1000 0 800 200 400 600 94071_07 i f = 30 a i f = 15 a i f = 5 a v r = 200 v t j = 125 c t j = 25 c d i (rec)m / d t (a/s) d i f / d t (a/s) 100 1000 100 10 000 1000 94071_08 v r = 200 v t j = 125 c t j = 25 c i f = 30 a i f = 15 a i f = 5 a
document number: 94071 for technical questions, contact: diodestech@vishay.com www.vishay.com revision: 22-feb-10 5 vs-HFA30TA60CSPBF hexfred ? ultrafast soft recovery diode, 2 x 15 a vishay high power products fig. 9 - reverse recovery parameter test circuit fig. 10 - reverse recovery waveform and definitions irfp250 d.u.t. l = 70 h v r = 200 v 0.01 g d s di f /dt adju s t q rr 0.5 i rrm di (rec)m /dt 0.75 i rrm i rrm t rr t b t a i f di f /dt 0 (1) (2) (3) (4) (5) (1) di f /dt - rate of change of current through zero cro ss ing (2) i rrm - peak rever s e recovery current (3) t rr - rever s e recovery time mea s ured from zero cro ss ing point of negative going i f to point where a line pa ss ing through 0.75 i rrm and 0.50 i rrm extrapolated to zero current. (4) q rr - area under curve dened by t rr and i rrm t rr x i rrm 2 q rr = (5) di (rec)m /dt - peak rate of change of current during t b portion of t rr
www.vishay.com for technical questions, contact: diodestech@vishay.com document number: 94071 6 revision: 22-feb-10 vs-HFA30TA60CSPBF vishay high power products hexfred ? ultrafast soft recove ry diode, 2 x 15 a ordering information table 2 - hexfred ? family 1 - hpp prod u ct s u ffix 3 - process designator: a = electron irradiated 4 -c u rrent rating (30 = 30 a) 5 - package o u tline (ta = to-220, 3 leads) 6 - voltage rating (60 = 600 v) 7 - circ u it config u ration (c = common cathode) 8 - s = d 2 pak - pbf = lead (pb)-free 10 9 - none = tube (50 pieces) trl = tape and reel (left oriented) trr = tape and reel (right oriented) device code 5 1 3 24 678910 vs- hf a 30 ta 60 c s trl pbf links to related documents dimensions www.vishay.com/doc?95046 part marking information www.vishay.com/doc?95054 packaging information www.vishay.com/doc?95032
document number: 95046 for technical questions within your region, please contact one of the following: www.vishay.com revision: 31-mar-11 diodesamericas@vishay.com , diodesasia@vishay.com , diodeseurope@vishay.com 1 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 d 2 pak outline dimensions vishay semiconductors dimensions in millimeters and inches notes (1) dimensioning and toleranc ing per asme y14.5 m-1994 (2) dimension d and e do not include mold flash. mold flash sh all not exceed 0.127 mm (0.005") per side. these dimens ions are measu red at the outmost extremes of the plastic body (3) thermal pad contour optional with in dimension e, l1, d1 and e1 (4) dimension b1 and c1 a pply to base metal only (5) datum a and b to be determined at datum plane h (6) controlling dimension: inch (7) outline conforms to jedec outline to-263ab symbol millimeters inches notes symbol millimeters inches notes min. max. min. max. min. max. min. max. a 4.06 4.83 0.160 0.190 d1 6.86 8.00 0.270 0.315 3 a1 0.00 0.254 0.000 0.010 e 9.65 10.67 0.380 0.420 2, 3 b 0.51 0.99 0.020 0.039 e1 7.90 8.80 0.311 0.346 3 b1 0.51 0.89 0.020 0.035 4 e 2.54 bsc 0.100 bsc b2 1.14 1.78 0.045 0.070 h 14.61 15.88 0.575 0.625 b3 1.14 1.73 0.045 0.068 4 l 1.78 2.79 0.070 0.110 c 0.38 0.74 0.015 0.029 l1 - 1.65 - 0.066 3 c1 0.38 0.58 0.015 0.023 4 l2 1.27 1.78 0.050 0.070 c2 1.14 1.65 0.045 0.065 l3 0.25 bsc 0.010 bsc d 8.51 9.65 0.335 0.380 2 l4 4.78 5.28 0.188 0.208 c b detail a c2 a a a 0.004 b m a lead tip (3) (3) view a - a (e) (d1) e1 b h a1 detail ?a? rotated 90 cw scale: 8 :1 l gauge plane 0 to 8 l3 l4 seating plane section b - b and c - c scale: none (4) (4) ( b , b 2) b 1, b 3 (c) c1 base metal plating conforms to jedec outline d 2 pak (smd-220) 13 2 d c a l2 e (2)(3) (2) 4 h bb 2 x b 2 x b 2 l1 0.010 a b mm (3) e 2 x pad layout min. 11.00 (0.43) min. 9.65 (0.3 8 ) min. 3. 8 1 (0.15) min. 2.32 (0.0 8 ) 17.90 (0.70) 15.00 (0.625) 2.64 (0.103) 2.41 (0.096) lead assignments diodes 1. - anode (two die)/open (one die) 2., 4. - cathode 3. - anode
document number: 91 000 www.vishay.com revision: 11-mar-11 1 disclaimer legal disclaimer notice vishay all product, product specifications and data ar e subject to change without notice to improve reliability, function or design or otherwise. vishay intertechnology, inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectivel y, vishay), disclaim any and all liability fo r any errors, inaccuracies or incompleteness contained in any datasheet or in any o ther disclosure relating to any product. vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. to the maximum extent permitted by applicab le law, vishay disc laims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, incl uding without limitation specia l, consequential or incidental dama ges, and (iii) any and all impl ied warranties, including warran ties of fitness for particular purpose, non-infringement and merchantability. statements regarding the suitability of pro ducts for certain types of applications are based on vishays knowledge of typical requirements that are often placed on vishay products in gene ric applications. such statements are not binding statements about the suitability of products for a partic ular application. it is the customers responsibility to validate that a particu lar product with the properties described in th e product specification is su itable for use in a particul ar application. parameters provided in datasheets an d/or specifications may vary in different applications and perfo rmance may vary over time. all operating parameters, including typical pa rameters, must be validated for each customer application by the customers technical experts. product specifications do not expand or otherwise modify vishays term s and conditions of purchase, including but not limited to the warranty expressed therein. except as expressly indicated in writing, vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the vishay product co uld result in person al injury or death. customers using or selling vishay products not expressly indicated for use in such applications do so at their own risk and agr ee to fully indemnify and hold vishay and it s distributors harmless from and against an y and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that vis hay or its distributor was negligent regarding the design or manufact ure of the part. please contact authorized vishay personnel t o obtain written terms and conditions regarding products designed fo r such applications. no license, express or implied, by estoppel or otherwise, to any intelle ctual property rights is gran ted by this document or by any conduct of vishay. product names and markings noted herein may be trademarks of their respective owners.
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